Service

Brittle Material Processing

We separate, grind and polish different materials...

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Separating

With the diamond-wire saws of Logomatic GmbH, our 100% daughter-company, we separate...

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Wafering

Ground silicon work-pieces will be wafered in this main process...

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Grinding

The grinding machines of G&N GmbH, our 100% daughter company, grind effortless...

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Infrared and lifetime measuring

With our infrared and lifetime measuring it is possible to check for SiC-nests (inclusions), cracks and other damages...

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Plasma Dry Etching

A homogeneous and efficiency rising surface structure will be produced at this process...

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